TOWARDS ENERGY-SAVING CHIPS FOR DIGITAL, ANALOG AND RF

The FAMES pilot line supports innovation in advanced semiconductor technologies for a sovereign European chip industry.

TOWARDS ENERGY-SAVING CHIPS FOR DIGITAL, ANALOG AND RF

The FAMES Pilot line supports innovation in advanced semiconductor technologies for a sovereign European chip industry.

FAMES Pilot Line

The FAMES Pilot Line pioneering initiative promotes semiconductor technologies in Europe by supporting the emergence of higher-performance, more energy-efficient, and more sustainable chip designs.

The objectives of the FAMES Pilot Line are to establish a domestic semiconductor Pilot Line for cutting-edge microelectronic technologies in Europe, and provide open access to this Pilot Line to stakeholders of the electronic value chain. These objectives are aligned with those of the EU Chips Act: bolster the EU semiconductor industry and support European technological sovereignty through innovations, facilitated access to R&D, and training.

A consortium of semiconductor R&D leaders

The FAMES Consortium brings together an outstanding group of partners : CEA-Leti, coordinator of the pilot line (France), imec (Belgium), Fraunhofer Mikroelektronik (Germany), Tyndall (Ireland), VTT (Finland), CEZAMAT WUT (Poland), UCLouvain (Belgium), Silicon Austria Labs (Austria), SiNANO Institute (France), Grenoble INP-UGA (France), and the University of Granada (Spain).

Sustainability - Technologies - FAMES Pilot Line

Responding to sustainability challenges

The development of FD-SOI at 10nm and 7nm nodes, combined with non-volatile memories (NVM) and 3D options, RF components and smart PMIC (power management for Integrated circuits) provides a pathway to deliver high-performance, low-power consumption solutions for future chips. These high-performance and low-power solutions will sustainably support the massive digitalization of our society by paving the way for new IC architectures, substantially reducing the overall circuit power consumption.

Semiconductor manufacturing, known for its technological precision, also generates a significant environmental footprint. The FAMES Pilot Line will drive eco-friendly practices by prioritizing resource optimization, advocating for a circular economy, and minimizing waste across the entire technological process, from chip design to manufacturing. Consequently, FAMES Pilot Line will significantly bolster the industry’s pursuit of achieving net-zero emissions by 2050.

FAMES technologies

The FAMES Pilot Line presents an unrivaled combination of forefront technologies, PDKs, demonstrators and process capabilities. The technologies developed in the FAMES Pilot Line will enable new chip architectures, and will allow new generations of microcontrollers, microprocessor units, chips for 5G/6G, smart imagers, smart sensors, processors for data fusion, wearable devices, trusted chips, quantum and cryoCMOS, edge AI chip and advanced packaging with chiplets, to name a few. The key pillar technologies of the FAMES Pilot Line are:

Experience unparalleled access to advanced technologies and pilot line capabilities

Through annual Open-Access Calls and user project submissions, the FAMES Pilot Line offers European semiconductor stakeholders (industry, research, and academia) access to a wide range of semiconductor technologies, including testing, PDKs, demonstrators and manufacturing capabilities.

This access will give users the opportunity to explore the miniaturization of electronics to address a wide spectrum of semiconductor markets, strengthening European leadership and opening up new opportunities. Through the technologies developed in the project and the access provided to the FAMES Pilot Line users, FAMES aims at increasing European technological leadership and at generating intellectual property.

News and Events

FAMES Pilot Line Inaugurated After Delivering First Validated Technical Results
The FAMES Pilot Line was officially inaugurated today—two years after it began, now delivering validated technical results across advanced FD-SOI, RF, embedded non-volatile memories, 3D integration technologies, and Power Management...
FAMES’ Second Open Access Launch
This workshop, held during EFECS 2025, will spotlight the latest results from the five FAMES technologies......
FAMES European FD-SOI Design School (EFDS)

FAMES European FD-SOI Design School (EFDS) The first European FD-SOI Design School will take place in Grenoble from January 25 to 30 2026, bringing together students, researchers, and industry professionals...

R&D Advances for the FAMES Pilot Line: 400 °C CMOS Breakthrough Opens Critical Doors to 3D Integration Goals
CEA-Leti, the coordinator of the FAMES Pilot line, has achieved a major milestone for next-generation chip stacking: fully functional 2.5 V SOI CMOS devices fabricated at 400 °C. The devices...
Partner’s Corner: Interview with Dr. Wenke Weinreich from Fraunhofer IPMS
Dr Wenke Weinreich is one of the partners involved in the Fames project. She joined the Fraunhofer Center for Nanoelectronic Technologies (CNT) in 2006 and became Director of the CNT...
Si:P and SiGe:B Dual epitaxy development for 10nm FD-SOI Raised Source-Drain
Introduction of strain is one of the main levers in order to achieve the performance for the new generation of 10nm FD-SOI devices. Tensile stress enhances the electron mobility for...

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All FAMES Partners undertake to respect their obligations in application of regulations in force and, especially, regulation (EU) 2016/679 of the European Parliament and of the Council of 27 April 2016, on the protection of natural persons with regard to the processing of personal data and on the free movement of such data (referred to as “GDPR”).

Contact

Leader of Work Package ​​3D and heterogeneous integration

Lilian Masarotto (CEA-Leti), Senior project manager

Request submitted!

Thank you for your registration. You will receive a copy by email. We will be getting in touch with you shortly to confirm or not your registration to the Winter school.

If you encountered an error or did not receive a copy (please check your spam), contact us.

FAMES European FD-SOI Design School (EFDS)

Winter School – 25-30 January 2026, Grenoble,  France
training costs: 1960€

All FAMES Partners undertake to respect their obligations in application of regulations in force and, especially, regulation (EU) 2016/679 of the European Parliament and of the Council of 27 April 2016, on the protection of natural persons with regard to the processing of personal data and on the free movement of such data (referred to as “GDPR”).

Spontaneous User Request

Please note that your answers will help us establish the eligibility of your request.

If you selected "3D Heterogeneous Integration Process Modules", please provide more details, otherwise please proceed to the next step.

All FAMES Partners undertake to respect their obligations in application of regulations in force and, especially, regulation (EU) 2016/679 of the European Parliament and of the Council of 27 April 2016, on the protection of natural persons with regard to the processing of personal data and on the free movement of such data (referred to as “GDPR”).

Request submitted!

Thank you for your request. You will receive a copy by email. We will be getting in touch with you shortly.

If you encountered an error or did not receive a copy (please check your spam), contact us at open-access-chair@fames-pilot-line.eu.

FAMES Open-Access Call User Request

Please note that your answers will help us establish the eligibility of your request.

All FAMES Partners undertake to respect their obligations in application of regulations in force and, especially, regulation (EU) 2016/679 of the European Parliament and of the Council of 27 April 2016, on the protection of natural persons with regard to the processing of personal data and on the free movement of such data (referred to as “GDPR”).

Spontaneous User Request

Please note that your answers will help us establish the eligibility of your request.

All FAMES Partners undertake to respect their obligations in application of regulations in force and, especially, regulation (EU) 2016/679 of the European Parliament and of the Council of 27 April 2016, on the protection of natural persons with regard to the processing of personal data and on the free movement of such data (referred to as “GDPR”).

Contact

Open Access chair person - FAMES Pilot Line

Open Access Chairperson

Susana Bonnetier (CEA-Leti)

For inquiries or problems regarding the Open Access/Spontaneous Request, you can contact us directly.

Trainings

CV :

Annual call