Editorial - FAMES Newsletter 5
As we wave goodbye to summer, it’s time to dive back into the action, and FAMES has been busy! The results are in, and they’re nothing short of impressive, spanning a wide array of technologies. While previous editions focused on FD-SOI front-end, this time we’re moving up to the middle of line (MOL) to showcase how back-end of line congestion can be tackled using MOL local connections, thanks to a clever contact anti-punch-through layer. But that’s not all! We’ve also proven that FD-SOI outperforms bulk technologies when it comes to fending off laser fault injection, making it a top contender for cybersecurity chips.
Tyndall has achieved a world-first in heterogeneous integration, demonstrating tether-free micro-transfer printing onto glass substrates and into silicon trenches for next-generation system on chip power management applications. Application-driven demonstrators are another area where FAMES excels, this time with the design of an FD-SOI transimpedance amplifier for massively parallel µLED/µPD communications, consuming as little as 170µW @ 6Gbps “the number that changes the conversation” as one LinkedIn commenter put it.
Silicon Austria Labs has delivered some very promising simulation results for planar self-biased miniaturised circulators. And, in a remarkable feat, FAMES has combined RRAM memristor arrays and stochastic magnetic tunnel junctions in a hybrid Ising machine to tackle combinatorial optimisation problems with outstanding efficiency.
As we steam ahead into the second half of the project, we’re not only amassing more results but also welcoming more users. We are very proud to announce our collaboration with Quobly, and give them access to state-of-the-art capabilities, thanks to our equipment procurement program. And we’re looking forward to welcoming you as a FAMES user too! You can submit a spontaneous request year-round or participate in our next Open-Access call, starting on 17 March 2027.
FAMES is also keen on sharing knowledge and offering top-notch training sessions. Whether you’re eager to learn more about FD-SOI, memories, 3D integration, RF components, or PMICs, our webpage is the right place to find the training that meets your expectations.
Lastly, be sure to catch up with our team at future events like Semicon Europa or EFECS. And if you’re particularly interested in our eco-innovation programme, don’t miss END’26!
Dominique Noguet, FAMES Project Coordinator.
