TECHNOLOGIES

FAMES technologies

FAMES can be used for the development and testing of five kinds of technologies :

FD-SOI
10nm and 7nm
Several types of embedded non-volatile memories
OxRAM, FeRAM, MRAM and FeFETs
Radiofrequency components
switches, filters, and capacitors
3D integration
heterogeneous and sequential
Small inductors for DC-DC converters
Power Management
Integrated Circuits (PMIC)

COMING SOON

At the core of FAMES lies the ambition to boost innovation, by transferring research outputs and leads to the industry for accelerating the development of prototypes and viable market products.

Invented by CEA-Leti, FD-SOI is a planar CMOS technology that offers the best PPAC-E (Performance, Power, Area, Cost and Environmental impact) for mixed circuits (mixing digital, analogue and radio-frequency blocks). FD-SOI has been adopted by world leaders due to its tight electrostatic control at the transistor level and because it is well suited for highly innovative power management technologies.

The booming FD-SOI market is therefore expecting the 10nm and 7nm next-generation nodes and no less than 43 companies in the semiconductor business, positioning at various levels of the electronic systems value chain (materials, equipment manufacturers, fabless, EDA, IDM, system houses, end-users) including SMEs, start-ups and world leaders, have formally expressed their support for the FAMES initiative.

Consortium partners

Trainings

CV :

Annual call

Submit a proposal