FAMES technical Workshop - LID World Summit 2026
The FAMES Payoff Begins
Wednesday, June 24, 2026

Semiconductor makers, startups, fabless companies and academic researchers will soon benefit from the pilot line’s breakthroughs in high-performance, low-power chips.
Learn how you can adapt FAMES’ FD-SOI 10-and-7nm process technologies, embedded NVMs, 3D integration, RF components, and power-management IC solutions for your own innovations.
Welcome & Introduction
Co-chairs
Dominique Noguet, FAMES Pilot Line Project Coordinator, CEA-Leti
Susana Bonnetier, FAMES Pilot Line Open Access Chairperson, CEA-Leti
Laurent Fesquet, Deputy Director of the TIMA Laboratory, Grenoble INP



Opening notes
Francisco Ignacio Serradilla, Programme Officer, Chips Joint Undertaking
FAMES Pilot Line opportunities for advanced chip design
09:35 a.m. – 10:00 a.m.
Dominique Noguet, FAMES Pilot Line Project Coordinator, CEA-Leti
UTBB FD-SOI and key enablers for the next generation node: A strategic EU-made technology...
10:20 a.m. – 10:40 a.m.
Claire Fenouillet-Beranger, Project Manager, CEA-Leti, CEA-Leti
Lunch, Exhibitions & Networking
12:00 p.m. – 02:30 p.m.
- Latest Demos: Discover more than 30 live demos and network with potential partners.
- Startups Corner: Don’t miss out on the startups corner to learn about the latest tech offers.
- Business Meetings: Book meetings with experts to discuss your innovation project.
- Partners Corner: Explore partners’ booth showcasing their technologies.

