FAMES - ChipsWIN Joint Event

The FAMES x ChipsWIN Joint Event, held in Louvain-la-Neuve on the 22 April 2026, gathered around 60 participants from industry, academia, and research organisations. The event created a great setting to connect people working on different parts of the semiconductor value chain, all with a shared goal: strengthening the innovation potential in electronics in Wallonia and beyond.

Organised in collaboration with ChipsWIN Walloon Chips Competence Center, the event highlighted the role of regional competence centres in accelerating innovation. ChipsWIN acts as a one-stop hub for semiconductor development, supporting startups, SMEs, and researchers from early-stage concepts to industrial prototyping, by combining technical platforms, training, and business support.

Throughout the day, FAMES team presented several talks on the Pilot Line, its technologies, demonstrators and open-access opportunities. These sessions sparked many discussions, both during and after the presentations, and helped identify concrete areas for collaboration. Furthermore, the panel discussion “EU Chips Act: from R&D to Industry”, involving representatives from industry, RTOs, and academia brainstorming on the transfer of R&D developments to industry, attracted significant interest.

One of the highlights of the workshop was the visit of the WELCOME and WINFAB platforms at UCLouvain. These infrastructures give a very tangible view of what the regional ecosystem can offer.

  • The WELCOME platform provides advanced electrical and electromagnetic characterisation capabilities and expertise, covering materials, devices, sensors, circuits, and systemsin a large frequency (up to mmWave) and temperature (from 4 to 573 K) ranges.
  • The WINFAB platform offers a 1000 m² cleanroom infrastructure dedicated to micro- and nano-fabrication, enabling processes such as lithography, thin-film deposition, etching, and device prototyping across applications ranging from CMOS and MEMS to photonics and 2D materials.

Beyond the presentations and visits, the day was marked by many valuable discussions and new connections. These exchanges are essential to build future collaborations and keep momentum within the European semiconductor community.

FAMES warmly thanks ChipsWIN for the invitation and looks forward to continuing these fruitful collaborations.

©VTT

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