4 December 2025 – The FAMES annual workshop entitled “FAMES Latest Achievements & Next Steps”, waschaired by Francine Papillon (FAMES Dissemination and Communication Head). It was opened by Dominique Noguet (FAMES project coordinator) who provided an overview of the Pilot Line.

FAMES Partners then delivered a series of technical presentations covering advances in ferroelectric embedded memories, RF self‑biased circulators, and the integration of passive components in the CMOS back-end-of-line. These presentations illustrated the steady progress of the consortium across the main technological building blocks of the FAMES Pilot Line.

Updates on skills development  and upcoming FAMES Academy training opportunities followed, reinforcing the project’s commitment to education and capacity building.

The workshop also featured a presentation of the Life Cycle Assessment methodology (LCA) developed within the FAMES project to support more sustainable semiconductor technologies and providing environmental assessment tools for future process development.

The session concluded with insights into how FAMES technologies are being made accessible to both academia and industry, reaffirming the project’s commitment to collaboration and technology transfer. On this occasion, the launch for the Open-Access 2026 call was announced for March 9, 2026).

As this was the annual event of the FAMES project, the 11 partners were well represented and actively engaged with many visitors  at both the booth and the annual event, presenting the Pilot Line and exploring opportunities within the broader ecosystem of the European Pilot Lines.

The strong interest and interactions of the EFECS participants confirmed the interest and attractivness of the FAMES Pilot Line and its advanced technologies.  The feedback received, as well as the numerous questions on Open Access and training opportunities, highlighted a strong interest from the community. These exchanges also reinforced the importance of fostering cooperation with Competence Centers, the Design platform, and other Pilot Lines, in alignment with the broader objectives of the EU Chips Act.

*EFECS (European Forum for Electronic Components and Systems) is one of Europe’s major annual events for the semiconductor and microelectronics community. Organised under the Chips Joint Undertaking, it brings together industry, research organisations, policymakers, and Pilot Lines to exchange insights, showcase technological progress, and strengthen collaboration across the European Electronic Components and Systems ecosystem. The event provides a unique platform for aligning technological roadmaps, discussing strategic priorities, and highlighting Europe’s collective efforts to reinforce its semiconductor capabilities.