The acquisition of the FAMES Pilot Line tools at CEA-Leti started in 2022 and consists in a list of 71 tools that was split in 3 batches according to the priorities set by the R&D work packages and the technical readiness for the evaluations. 

The installation of equipment at CEA-Leti is a part of the broader distributed FAMES Pilot Line, which is being progressively deployed across the four FAMES hosting sites located in France, Ireland, Finland and Austria.

Together, these sites provide pilot line capabilities to support the FAMES R&D activities and, subsequently, enable an open-access to the development and industrial validation of next-generation semiconductor technologies in Europe.

Currently, all the 22 tools of batch1, have been ordered, delivered and will be all fully accepted by end of Q2 2026.  Batch2 counts 26 pieces of equipment, of which 23 have already been ordered.  As for batch3, an additional list of 23 tools has been finalized to complete CEA-Leti’s contribution to the Pilot Line, and half of the tenders have already been launched.  

The new 2,000 m² cleanroom (code name 41.03) complements CEA-Leti’s existing 11,000 m² cleanroom infrastructure and supports the deployment of the FAMES Pilot Line. This new facility is designed to host the latest generation of semiconductor manufacturing equipment and will further strengthen CEA-Leti’s advanced 300 mm capabilities within the FAMES Pilot Line.

The FAMES Pilot Line new tools will support the development of FD-SOI devices, embedded non-volatile memories, 3D integration, RF technologies and passive components for power management ICs. They also constitute a key asset of the Open Access program for the Pilot Line users.

The first five tools installed in the new building are: a FOUP purge system, a laser anneal equipment, a dry etch tool, a dielectric deposition tool and a wafer sorter.

The arrivals for the next quarter will be a lithography coater and developer track for 193nm immersion scanner, and a tool for Advanced Copper seed/liner Co/Co capping.

The FAMES programme is structured according to the ramp-up deployment of equipment and the associated availability of technologies across the pilot line. This stepwise approach first strengthens R&D capabilities through the gradual availability of new equipment, enabling the development of more advanced technologies and ultimately expanding open-access opportunities for users across Europe.