FAMES technical Workshop
EU Chips Access & Innovation
November 17th, 2025
Join us in Linz for the EU CHIPS ACCESS & INNOVATION Workshop and explore the future
of microelectronics – with inspiring keynotes, top-level speakers, and excellent
networking opportunities. We’re happy to welcome you in Linz!
The FAMES Pilot Line provides chipmakers, startups, fabless companies and academics with a pathway to high-performance, low-power chips. Learn how you can explore advanced FD-SOI 10 nm and 7 nm process technologies, embedded non-volatile memories, 3D integration, RF components, and power management integrated circuit solutions.
Programme
FAMES Workshop
Registration
08:30 a.m. – 09:00 a.m.
Welcome Address
09:00 a.m. – 09:15 a.m.
Christina Hirschl, CEO, Silicon Austria Labs
Ana Almansa, Austrian Government
Dominique Noguet, FAMES Project Coordinator
Keynote - Chips for Europe Inititive
9:15 – 9:30
Francisco Ignacio Serradilla, Senior Programme Officer, Chips Joint Undertaking
Keynote - The FAMES Pilot Line
9:30 – 9:45
Dominique Noguet, FAMES Project Coordinator
Panel Discussion Open Access Mechanism & Services
9:45: 10:15
Angeline Tee, Senior Manager, Silicon Austria Labs
Piia Konstari, Director of Microfabrication Services, VTT
Piotr Wiśniewski, Head of Intelligent Semiconductor Systems Division, CEZAMAT
Philippe Flatresse, Product Marketing, SOITEC
Chair: Susana Bonnetier, FAMES Pilot Line Open-Access Chairperson, CEA-Leti
Teasers for Interactive Focus Topics
10:15 – 10: 50
Emily Gallagher, imec
Karl-Magnus Persson, VTT
Valeriya Kilchytska, UC Louvain
Konrad Seidel, Fraunhofer IPMS
Emmanuel Ollier, CEA-Leti
Somnath Pal, Silicon Austria Labs
Coffee & Focus Topic Islands + Networking
10:50 – 12:20
Lunch
AT-C3 The Austrian Chips Competence Center Session
Introduction to AT-C3 & European-level activities
13:20 – 13:35
Borislav Hinkov, AT-C3 SAL coordinator, Silicon Austria Labs
Opportunities for start-ups and SMEs to get support
13:35 – 13:50
Olivier Lechevin, AT-C3 Coordinator, Silicon Alps Cluster
Getting Access to the Pilot Lines, espacially FAMES
13:50 – 14:00
Borislav Hinkov, AT-C3 SAL coordinator, Silicon Austria Labs
Panel Discussion: Chips Competence Centers as supporting element for the European Chips Ecosystem
14:00 – 14:30
Borislav Hinkov, Silicon Austria Labs
Olivier Lechevin, Silicon Alps Cluster
Akbarjon Usarov, Silicon Alps
Guenther Maier, Materials Center Leoben Forschung GmbH and Polymer Competence Center Leoben GmbH
Henrik Siboni, TU Graz
Stefan Schauer, Austrian Institute of Technology
Chair: Christina Hirschl, CEO, Silicon Austria Labs
14:00 – 14:30
Coffee Break
14:30 – 15:00
EuroCDP The European Chips Design Platform Session
Overview of the EuroCDP and its role in the European IC Ecosystem
15:00 – 15:10
Emanuele Bottino, EU Projects Coordinator, Silicon Austria Lab
PCT, Central Services & Licenses Agreements. How and when to use them
15:10 – 15:25
Emanuele Bottino, EU Projects Coordinator, Silicon Austria Lab
PCT, Central Services & Licenses Agreements. How and when to use them
15:25 – 15:35
Diego Gigena-Ivanovic, Electronic Engineer, Silicon Austria Lab
Start-up Programmes and DET IC-Design Services
15:35 – 15:50
Emanuele Bottino, EU Projects Coordinator, Silicon Austria Lab
Q&A
15:50 – 16:00
End & Wrap-Up
16:00 – 16:15
Networking
16:00 – 17:00
17:30 – 19:00: Bus Transfer to SEMICON Munich (Hop #1)
19:00 – 19:20 Social Snack Break
19:20 – 20:50 Bus Transfer to SEMICON Munich (Hop #2)
