FAMES technical Workshop
Empowering the next generation of European Chips
Wednesday, June 18, 2025
The FAMES Pilot Line provides chipmakers, startups, fabless companies and academics with a pathway to high-performance, low-power chips. Learn how you can explore advanced FD-SOI 10 nm and 7 nm process technologies, embedded non-volatile memories, 3D integration, RF components, and power management integrated circuit solutions.
This workshop will take place in the framework of the CEA-Leti Innovation Days – LID World Summit.
Programme
Morning Session
Welcome & Introduction
Co-chairs
Dominique Noguet, FAMES Pilot Line Project Coordinator, CEA-Leti
Susana Bonnetier, FAMES Pilot Line Open Access Chairperson, CEA-Leti
Laurent Fesquet, Deputy Director of the TIMA Laboratory, Grenoble INP
Opening notes
Francisco Ignacio Serradilla, Programme Officer, Chips Joint Undertaking
FAMES Pilot Line opportunities for advanced chip design
09:35 a.m. – 10:00 a.m.
Dominique Noguet, FAMES Pilot Line Project Coordinator, CEA-Leti
Taking advantage of FD-SOI transistor specificities
10:00 a.m. – 10:20 a.m.
Thierry Poiroux, Project Manager, CEA-Leti
UTBB FD-SOI and key enablers for the next generation node: A strategic EU-made technology...
10:20 a.m. – 10:40 a.m.
Claire Fenouillet-Beranger, Project Manager, CEA-Leti, CEA-Leti
Non-volatile memories for embedded solutions on 22 nm FD-SOI node and beyond: Technologies and applicative circuits development... more info
10:20 a.m. – 10:40 a.m.
Gabriel Pares, Project Manager, CEA-Leti
Get some fresh ideas: 180-second pitch by a talented young scientist
11:00 a.m. – 11:05 a.m.
Panel session: Fames Pilot Line Open Access opportunities
11:05 a.m. – 11:30 a.m
Susana Bonnetier, CEA-Leti; Dr. Laurent Fesquet, Grenoble INP; Dr. Sambuddha Khan, Tyndall; Angeline Tee, Silicon Austria Labs; Karl-Magnus Persson, VTT
Lunch, Exhibitions & Networking
12:00 p.m. – 02:30 p.m.
- Latest Demos: Discover more than 30 live demos and network with potential partners.
- Startups Corner: Don’t miss out on the startups corner to learn about the latest tech offers.
- Business Meetings: Book meetings with experts to discuss your innovation project.
- Partners Corner: Explore partners’ booth showcasing their technologies.
Afternoon Session
RF circulators for the FAMES Pilot Line... more info
02:30 p.m. – 02:55 p.m.
Somnath Pal, Silicon Austria Labs
3D heterogeneous integration of chiplets in an open ecosystem
02:55 p.m. – 03:15 p.m.
Emmanuel Ollier, Program Manager, CEA-Leti
Micro-inductors on silicon for integrated DC-DC converters
03:15 p.m. – 03:35 p.m.
Cian Ó Mathúna, Director Integrated Power and Energy Systems, Tyndall National Institute
E-score for reducing the environmental footprint of IC chip manufacturing
03:15 p.m. – 03:35 p.m.
Cédric Rolin, Program Manager, IMEC
Get some fresh ideas: 180-second pitch by a talented young scientist
04:00 p.m. – 04:05 p.m.
Panel session: FAMES Academy essential skills for designing in FD-SOI
04:05 p.m. – 04:30 p.m.
Laurent Fesquet & Sana Ibrahim, Grenoble INP; Cian Ó Mathúna, Tyndall; Lucille Engels, IC’Alps; Hervé Ribot, Minalogic.
Coffee Break, Exhibitions & Networking
04:30 p.m. – 05:30 p.m.
Closing remarks by Jari Kinaret, Executive Director at Chips Joint Undertaking
Bonus: Attendees will receive the conference proceedings after the event
For more information about the venue information or about the CEA-Leti Innovation Days – LID World Summit, please visit the CEA-Leti Website.
photo credits – © CEA-Leti
