EFDS_2026_J03_TD_3

In summary 

This short course on FD-SOI technology is intended for experienced chip designers, technologists and newcomers to the field. Led by industry experts, it will provide a comprehensive overview of FD-SOI technology and its benefits, addressing multiple aspects of circuit design.
Participants will learn how to efficiently design digital, analog and RF circuits for key application markets. The tutorials will present advanced FD-SOI design techniques and methodologies that drive the development of innovative IP and products across various domains.

 

TRAINING PROGRAM

Day 1 – 13:30-17:30  

WELCOME AND INTRODUCTION                                   

  • Arrival and welcome of participants
  • Unlocking Design Potential with FD-SOI: Next Wave in Semiconductor Innovation
  • FAMES project overview and opportunities

Break – 15:00-15:30 (30’)

FD-SOI : PRINCIPLES AND INNOVATION OPPORTUNITIES

  • From Bulk CMOS to FD-SOI
  • Taking advantage of FD-SOI transistor – Advanced RF Design with CMOS FD-SOI:
    Performance, Efficiency and Design Flexibility
  • Evolution of technologies from 10nm & 7nm Nodes until the end of Roadma
  •  
Day 2 – 08:30-16:30  

USING FD-SOI TO DRIVE ADVANCED CHIP ARCHITECTURE DEVELOPMENT

  • FD-SOI design flow for digital circuits design

Break – 10:00-10:30 (30’)

  • FD-SOI technology: is it a game changer in Power Management Design?
  • Benefits of FD-SOI for the design of oscillators
  • Unlocking RF Design with FD-SOI: Key Advantages and Opportunities

Lunch and networking – 12:00-13:30 

  • An immersive clean room experience at CEA-Leti
  • 10nm FD-SOI Pathfinding DK : From generative methods to technology benchmarking
  • Non-Volatile Memories for Embedded Solutions on 22 nm FD-SOI Node and Beyond
  • FAMES collaboration opportunities and open access mechanisms

Wrap-up

 

Audience

This course is primarily aimed at technologists, engineers and scientists who are actively engaged in researching, developing and manufacturing advanced electronic devices. This includes students and professionals from industry and academia who are interested in integrating, fabricating and scaling electronic systems. These individuals may include:

  • Chip designers involved in the development of low-power, high-performance ICs.
  • Device and process engineers working on advanced node development and integration.
  • R&D scientists exploring next-generation technologies for scalable electronics.
  • Technology managers and system architects may also be interested in gaining seeking a deeper scientific and technical understanding of FD-SOI platforms.

 

Prerequisites

This course is designed to establish the scientific foundation for the complete design–integration–production chain of FD-SOI devices and related technologies. Participants are expected to have a solid understanding of integrated circuit design fundamentals, including CMOS technology, digital and analog circuit design principles, process design flows, and basic layout techniques. Prior experience with device modelling and simulation tools would be an advantage.

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All FAMES Partners undertake to respect their obligations in application of regulations in force and, especially, regulation (EU) 2016/679 of the European Parliament and of the Council of 27 April 2016, on the protection of natural persons with regard to the processing of personal data and on the free movement of such data (referred to as “GDPR”).

Contact

Leader of Work Package ​​3D and heterogeneous integration

Lilian Masarotto (CEA-Leti), Senior project manager

Request submitted!

Thank you for your registration. You will receive a copy by email. We will be getting in touch with you shortly to confirm or not your registration to the Winter school.

If you encountered an error or did not receive a copy (please check your spam), contact us.

FAMES European FD-SOI Design School (EFDS)

Winter School – 25-30 January 2026, Grenoble,  France
training costs: 1960€

All FAMES Partners undertake to respect their obligations in application of regulations in force and, especially, regulation (EU) 2016/679 of the European Parliament and of the Council of 27 April 2016, on the protection of natural persons with regard to the processing of personal data and on the free movement of such data (referred to as “GDPR”).

Spontaneous User Request

Please note that your answers will help us establish the eligibility of your request.

If you selected "3D Heterogeneous Integration Process Modules", please provide more details, otherwise please proceed to the next step.

All FAMES Partners undertake to respect their obligations in application of regulations in force and, especially, regulation (EU) 2016/679 of the European Parliament and of the Council of 27 April 2016, on the protection of natural persons with regard to the processing of personal data and on the free movement of such data (referred to as “GDPR”).

Request submitted!

Thank you for your request. You will receive a copy by email. We will be getting in touch with you shortly.

If you encountered an error or did not receive a copy (please check your spam), contact us at open-access-chair@fames-pilot-line.eu.

FAMES Open-Access Call User Request

Please note that your answers will help us establish the eligibility of your request.

All FAMES Partners undertake to respect their obligations in application of regulations in force and, especially, regulation (EU) 2016/679 of the European Parliament and of the Council of 27 April 2016, on the protection of natural persons with regard to the processing of personal data and on the free movement of such data (referred to as “GDPR”).

Spontaneous User Request

Please note that your answers will help us establish the eligibility of your request.

All FAMES Partners undertake to respect their obligations in application of regulations in force and, especially, regulation (EU) 2016/679 of the European Parliament and of the Council of 27 April 2016, on the protection of natural persons with regard to the processing of personal data and on the free movement of such data (referred to as “GDPR”).

Contact

Open Access chair person - FAMES Pilot Line

Open Access Chairperson

Susana Bonnetier (CEA-Leti)

For inquiries or problems regarding the Open Access/Spontaneous Request, you can contact us directly.

Trainings

CV :

Annual call