The adoption of the cutting-edge technologies of the FAMES Pilot Line requires that designers are trained to master their latest developments. The FAMES Academy has been created for this purpose. A key element of this FAMES training initiative is the FAMES school, which will be organised annually from 2025 to 2028. An inaugural event took place alongside the CEA-Leti Innovation Days / LID World Summit in June 2025, creating an ideal setting to showcase FAMES technologies and present the forthcoming training events organised by the FAMES Academy. This first workshop, took the form of two technical sessions combining education and interaction with the audience. 180 participants attended two half-day sessions:

The Opening was held by the Programme Officer at the Chips JU and Project Coordinator of the FAMES Pilot Line at CEA-Leti. They presented the vision of the Chips JU and the objectives of the FAMES Pilot Line and its opportunities for advanced chips.

Project managers at CEA-Leti and FAMES workpackage leaders, highlighted advancements in FD-SOI technology and eNVMs. A panel session chaired by the FAMES Pilot Line Open Access Chair Person at CEA-Leti, detailed the Open Access opportunities of the FAMES Pilot Line, application process, eligibility, timelines, and services available in 2025.

In the second session, experts shared key innovations supporting advanced electronics: Silicon Austria Labs detailed RF circulators for 5G and beyond; and CEA-Leti presented 3D chiplet integration; Tyndall National Institute introduced silicon-based micro-inductors for DC-DC converters; and imec showcased the E-Score method to cut IC manufacturing’s environmental impact. A closing panel chaired by Laurent Fesquet (Grenoble INP), leader of the FAMES training activities, stressed the importance of specialised training in FD-SOI design and characterisation to meet industry needs and ensure a skilled workforce.

The event clearly met its objective: participants were attracted by the opportunities offered by FD-SOI technology and some were already planning to design innovative devices. Associated technologies, such as eNVM, RF components, 3D packaging options and PMIC were also seen as strong assets bringing many questions to the experts, both during the talks and informal exchanges.

The networking-friendly atmosphere drew a wide variety of participants, with a mix of small businesses, start-ups and larger companies. Young researchers were also present, eager to develop their expertise in FD-SOI through the FAMES Academy programmes.

The panel discussions added the possibility to interact with the audience and collect the expectations. They highlighted both innovation potential offered by the FAMES Pilot Line, and the importance of developing tailored training. The Open Access drew a lot of interest from the audience, as participants discovered the different ways of engaging with the pilot line through the annual call for projects or via spontaneous proposals. The round table on training and skills development confirmed that the FAMES strategy is aligned with industry needs.

It has to be pointed out that the event opened with a powerful message from Francisco Ignacio Serradilla, Programme Officer at Chips JU, on Europe’s microelectronics ambitions, and closed with an inspiring outlook from Professor Jari Kinaret, Executive Director of Chips JU. Their presence underlined the FAMES project’s key role in advancing Europe’s technological sovereignty in semiconductors.