Equipment – FAMES Pilot Line

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A New Era in Wafer-Scale Device Characterization for VTT

We are thrilled to announce a transformative upgrade to VTT’s laboratories: the acquisition of five new state-of-the-art electrical parameter analysers with fast pulsing capabilities. The upgrade is vital to VTT’s goal of developing a wafer-scale pilot-line for back-end-of-line (BEOL) compatible ferroelectric field-effect-transistors (FeFETs).

SAL receives Applied Materials PECVD tool for 200mm dielectrics thin films deposition

Silicon Austria Labs has received its Centura™ PECVD tool from Applied Materials, supporting dielectrics deposition for RF circulators on 200mm wafers. The tool is in commissioning phase and targets the end of 2025 for full qualification.

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Private Area

Category: Equipment

A New Era in Wafer-Scale Device Characterization for VTT

SAL receives Applied Materials PECVD tool for 200mm dielectrics thin films deposition

Leader of Work Package 3D and heterogeneous integration

Open Access Chairperson

Private Area

Category: Equipment

A New Era in Wafer-Scale Device Characterization for VTT

SAL receives Applied Materials PECVD tool for 200mm dielectrics thin films deposition

Leader of Work Package ​​3D and heterogeneous integration

Open Access Chairperson

Leader of Work Package 3D and heterogeneous integration