Meet FAMES at ESSERC 2026 in Mallorca

Learn how you can adapt FAMES’ FD-SOI 10-and-7nm process technologies, embedded NVMs, 3D integration, RF components, and power-management IC solutions for your own innovations.
FAMES in Granada: A Week of Scientific Exchange, Innovation and Collaboration

FAMES in Granada: A Week of Scientific Exchange, Innovation and Collaboration From 18 to 22 May 2026, the FAMES Pilot Line team was in Granada, Spain, for a week dedicated to semiconductor innovation, taking part in both the IRDS/ISRDS Event and the EuroSOI-ULIS Conference. The events brought together researchers, students and technology experts from across […]
FAMES – ChipsWIN Joint Event

FAMES – ChipsWIN Joint Event The FAMES x ChipsWIN Joint Event, held in Louvain-la-Neuve on the 22 April 2026, gathered around 60 participants from industry, academia, and research organisations. The event created a great setting to connect people working on different parts of the semiconductor value chain, all with a shared goal: strengthening the innovation […]
FAMES in Granada: A Week Dedicated to Semiconductor Innovation

FAMES will be present in Granada for an exceptional week that brings together two important international events in the semiconductor field…
Europe’s chip sovereignty grows stronger as Finland and the Nordics contribute to building a resilient semiconductor ecosystem.

Europe’s chip sovereignty grows stronger as Finland and the Nordics contribute to building a resilient semiconductor ecosystem. The Technical Chips JU Pilot Lines Workshop in Helsinki highlighted how Europe is strengthening semiconductor sovereignty, resilience, and competitiveness. Finnish and Nordic capabilities in research, infrastructure, and collaboration can help turn Europe into a stronger and more visible […]
FAMES – ChipsWIN Joint Event: strengthening semiconductor innovation in Wallonia and beyond

Learn how you can adapt FAMES’ FD-SOI 10-and-7nm process technologies, embedded NVMs, 3D integration, RF components, and power-management IC solutions for your own innovations.
The FAMES Payoff Begins – LID World Summit 2026

Learn how you can adapt FAMES’ FD-SOI 10-and-7nm process technologies, embedded NVMs, 3D integration, RF components, and power-management IC solutions for your own innovations.
FAMES technical session at “Chips from the North”

This workshop, held during EFECS 2025, will spotlight the latest results from the five FAMES technologies…
FAMES Pilot Line Inaugurated: Europe’s New Chip Innovation Hub

The FAMES Pilot Line was inaugurated at CEA in Grenoble, gathering European partners, industry and public authorities around the €830M initiative. Already operational, FAMES supports the development of next-generation semiconductor technologies across five key technologies, while providing open access to its pilot line to accelerate innovation and industrial transfer across Europe.
FAMES’ Second Open Access Launch

This workshop, held during EFECS 2025, will spotlight the latest results from the five FAMES technologies…


