FAMES Annual Event at EFECS 2026 in Helsinki

From 2 to 4 December, 2026, in Helsinki, Finland, FAMES will be at the next edition of the European Forum for Electronic Components and Systems (EFECS 2026), for a week of networking opportunities and cultural activities.
Meet FAMES at END 2026

FAMES will be present at the Symposium for Sustainable Electronics and Digital Technology (END) in Grenoble on 14–15 December 2026, with at least one presentation. The event will bring together academic and industrial researchers around more sustainable approaches to electronics and digital technologies.
FAMES at SEMICON Europa 2026

FAMES will join the Chips JU booth at SEMICON Europa 2026 in Munich, alongside the other European Pilot Lines. The event will provide an opportunity to present FAMES technologies and connect with industry and research stakeholders.
FAMES at ESSERC2026 in Palma de Mallorca: Scientific Exchange and Collaboration

FAMES and the SiNANO Institute joined ESSERC 2026 in Palma de Mallorca with a dedicated workshop bringing together partners to present recent results across FD-SOI technologies. The event also provided an opportunity to discuss FAMES technologies, access opportunities and collaboration with the semiconductor community.
FAMES at LID World Summit: Where Innovation Meets Collaboration

FAMES at LID World Summit: Where Innovation Meets Collaboration The second FAMES School brought together 190 participants on 24 June 2026 and successfully showcased the opportunities offered by FD-SOI technology. Breakthrough results and complementary technologies, including eNVM and RF, generated strong interest and active discussions. The event also featured a round table on training and […]
Meet FAMES at ESSERC 2026 in Mallorca

Learn how you can adapt FAMES’ FD-SOI 10-and-7nm process technologies, embedded NVMs, 3D integration, RF components, and power-management IC solutions for your own innovations.
FAMES in Granada: A Week of Scientific Exchange, Innovation and Collaboration

FAMES in Granada: A Week of Scientific Exchange, Innovation and Collaboration From 18 to 22 May 2026, the FAMES Pilot Line team was in Granada, Spain, for a week dedicated to semiconductor innovation, taking part in both the IRDS/ISRDS Event and the EuroSOI-ULIS Conference. The events brought together researchers, students and technology experts from across […]
FAMES – ChipsWIN Joint Event

FAMES – ChipsWIN Joint Event The FAMES x ChipsWIN Joint Event, held in Louvain-la-Neuve on the 22 April 2026, gathered around 60 participants from industry, academia, and research organisations. The event created a great setting to connect people working on different parts of the semiconductor value chain, all with a shared goal: strengthening the innovation […]
FAMES in Granada: A Week Dedicated to Semiconductor Innovation

FAMES will be present in Granada for an exceptional week that brings together two important international events in the semiconductor field…
Europe’s chip sovereignty grows stronger as Finland and the Nordics contribute to building a resilient semiconductor ecosystem.

Europe’s chip sovereignty grows stronger as Finland and the Nordics contribute to building a resilient semiconductor ecosystem. The Technical Chips JU Pilot Lines Workshop in Helsinki highlighted how Europe is strengthening semiconductor sovereignty, resilience, and competitiveness. Finnish and Nordic capabilities in research, infrastructure, and collaboration can help turn Europe into a stronger and more visible […]


