Editorial – FAMES Newsletter #5
Editorial – FAMES Newsletter 5 As we wave goodbye to summer, it’s time to dive back into the action, and FAMES has been busy! The results are in, and they’re nothing short of impressive, spanning a wide array of technologies. While previous editions focused on FD-SOI front-end, this time we’re moving up to the middle […]
FAMES Interview – Gabriel Parès
FAMES Interview – Gabriel Parès FAMES Embedded Non-Volatile Memories (eNVM) Expert Could you introduce yourself, your research topic, and your role within the FAMES project? I am Gabriel Parès, a research engineer at CEA-Leti with a background in material science and semiconductor technologies with over 33 years of experience in semiconductors and MEMS, including different […]
Partner’s corner: Mariusz WIELEC, CEZAMAT-WUT
Partner’s corner: Mariusz WIELEC, CEZAMAT-WUT The Centre for Advanced Materials and Technologies (CEZAMAT) at the Warsaw University of Technology is Poland’s greatest investment in high technologies. CEZAMAT WUT is a research centre enabling interdisciplinary research into the materials and technologies of tomorrow. CEZAMAT offers access to a semiconductor technology infrastructure that enables research into semiconductor […]
Editorial – FAMES Newsletter #4
Come learn how you, too, can access the FAMES Pilot Line technologies!
Join us in Brussels, Belgium on March 18, 2025.
Partner’s corner: Christina Hirschl, SAL
Partner’s corner: Christina Hirschl, SAL Silicon Austria Labs (SAL) is Austria’s top research center for electronics and software based systems (ESBS). The application-oriented center offers cooperative research on future-oriented solutions for environmental protection, health, energy, mobility and safety at three locations – Graz, Linz and Villach. SAL is developing RF self-biased circulators for the FR3 […]
Meet a FAMES’ researcher: Interview with Francisco Gamiz
Francisco Gamiz, Professor at the University of Granada, specializes in integration of 2D materials for advanced semiconductor technologies. Within FAMES, he is developing a 2D-material platform aimed to be compatible with industrial CMOS processes. He discusses in this interview the challenges and opportunities of such integration.
Editorial – FAMES Newsletter #3
Come learn how you, too, can access the FAMES Pilot Line technologies!
Join us in Brussels, Belgium on March 18, 2025.
Meet a FAMES’ researcher: Interview with Claire Fenouillet-Béranger
Claire Fenouillet‑Béranger is Director of Research and Fellow Expert at CEA‑LETI, internationally recognized for her pioneering work in advanced device integration and her two decades of leadership in FD‑SOI technology, currently leading the 10 nm FD‑SOI integration at LETI and WP4 within FAMES.
Partner’s corner: Pekka Pursula, VTT
Come learn how you, too, can access the FAMES Pilot Line technologies!
Join us in Brussels, Belgium on March 18, 2025.
Editorial – Second FAMES Newsletter
Come learn how you, too, can access the FAMES Pilot Line technologies!
Join us in Brussels, Belgium on March 18, 2025.
